| Customization: | Available |
|---|---|
| Encapsulation Structure: | SMD |
| Application: | Electronic Products |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
|---|
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Features
• Low Power Loss, Hgih Efficiency
• High Surge Capability
• High Current Capability and Low Forward Voltage Drop
• Lead free in compliance with EU RoHS 2.0 • Green molding compound as per IEC 61249 standard






